Product Families

PolyMide™ CoPa

PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.

PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.

  • PolyMide™
  • CoPA (Nylon)
  • 1.75 mm
  • 2.85 mm
  • 750g
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Description

PRINT SETTINGS

Nozzle Temperature:
250˚C – 270˚C

Printing Speed:
30mm/s – 50mm/s

Bed Temperature:
25˚C – 70˚C

Bed Surface:
Glass with glue

Cooling Fan:
OFF

MECHANICAL PROPERTIES

Young’s Modulus:
2223 ± 199 Mpa

Tensile Strength:
66.2 ± 0.9 Mpa

Bending Strength:
97.0 ± 1.1 Mpa

Impact Strength:
9.6 ± 1.4 kJ/m2

THERMAL PROPERTIES

Glass Transition Temperature:
67˚C

Vicat Softening Temperature:
180˚C

Melting Temperature:
190˚C

NOTES

Drying Settings:
80˚C for 12h

Recommended Support Materials:
PolyDissolve™ S1

Other:
It is highly recommended to use the PolyBox™ when printing with PolyMide™ CoPA and to store it in the resealable bag.
To ensure a good heat resistance of your printed part it is recommended to anneal your PolyMide™ CoPA 3d printed model.
Annealing settings: 70˚C for 2h

TDS:
Download

SDS:
Download

TECHNOLOGY

PolyMide™ CoPA features Polymaker's Warp-Free™ technology:

Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.