PolyMide™ Series
PolyMide™ PA612-CF is a carbon fiber reinforced polyamide filament based on a copolymer of PA6 and PA12. Thanks to its chemical structure, this product has lower moisture sensitivity compared to PA6/66 and PA6-based materials, and better mechanical properties than PA12-based materials. In addition, the carbon fiber reinforcement and Warp-free technology enhance the dimensional stability of the prints produced with this material.
PolyMide™ PA612-CF exhibits enhanced rigidity and strength in wet conditions compared to PolyMide™ PA6-CF, owing to its longer chemical chain. While both materials do absorb moisture, PA612-CF demonstrates minimal reduction in mechanical properties, resulting in superior overall performance in wet environments when compared to PA6-CF.
Yes, we have ensured the dimensional stability of the cardboard by subjecting it to a temperature of 100°Ê in the oven. This meticulous drying process guarantees that the cardboard remains free from warping and distortion.
Warp-Free technology
Fiber adhesion technology
* Please note that availability of certain SKUs may vary by location and not all products may be accessible at every reseller. We recommend contacting your local reseller for specific product availability in your region. You can also contact our regional sales team for more details.
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Please fill in the form below or if you have other questions are not included in the form, please contact us through [email protected]. We will get back to you soon.