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Dry state

Wet state

Printability

The printability of the material is defined by its ease of use and equipment required.

Rigidity

The rigidity of the material is defined by its modulus:Young’s modulus
ISO 527, GB/T 1040.

Heat Resistance

The heat resistance of the material is defined by its VST: Vicat Softening temperature
ISO 306 GB/T 1633.

Weather Resistance

The weather resistance of the material is defined by its UV resistance. The data provided is currently an estimation.

Durability

The durability of the material is defined by its resistance to impact:Charpy impact strength
ISO 179, GB/T 1043.A

*PolyMide™ PA6-CF and PolyMide™ PA6-GF heat resistance are defined by their HDT: Heat Deflection Temperature
ISO 75 0.45 MPa.

PolyMide™ Series

PolyMide™ PA612-CF

PolyMide™ PA612-CF is a carbon fiber reinforced polyamide filament based on a copolymer of PA6 and PA12. Thanks to its chemical structure, this product has lower moisture sensitivity compared to PA6/66 and PA6-based materials, and better mechanical properties than PA12-based materials. In addition, the carbon fiber reinforcement and Warp-free technology enhance the dimensional stability of the prints produced with this material.

Low moisture sensitivity

Excellent mechanical properties

Prints Reliably

Find a Reseller

Color Range

Regular

Inquiry

Product Availability

Product Information Sheet

Safety Data Sheet

Technical Data Sheet

FAQ

What is the difference betweenPolyMide™ PA612-CF andPolyMide PA6-CF ?

PolyMide™ PA612-CF exhibits enhanced rigidity and strength in wet conditions compared toPolyMide PA6-CF, owing to its longer chemical chain. While both materials do absorb moisture, PA612-CF demonstrates minimal reduction in mechanical properties, resulting in superior overall performance in wet environments when compared to PA6-CF.

Is it safe while putting cardboard spool to dry thePolyMide™ PA612-CF in the oven?

Yes, we have ensured the dimensional stability of the cardboard by subjecting it to a temperature of 100℃ in the oven. This meticulous drying process guarantees that the cardboard remains free from warping and distortion.

What is the difference between PolyMide™ PA612-CF and PolyMide™ PA6-CF ?

PolyMide™ PA612-CF exhibits enhanced rigidity and strength in wet conditions compared to PolyMide™ PA6-CF, owing to its longer chemical chain. While both materials do absorb moisture, PA612-CF demonstrates minimal reduction in mechanical properties, resulting in superior overall performance in wet environments when compared to PA6-CF.

Is it safe while putting cardboard spool to dry the PolyMide™ PA612-CF in the oven?

Yes, we have ensured the dimensional stability of the cardboard by subjecting it to a temperature of 100°Ê in the oven. This meticulous drying process guarantees that the cardboard remains free from warping and distortion.

500g

Specifications

PolyMide™ PA612-CF

print
settings

Printing Temperature:

250˚C - 300˚C

Bed Temperature:

25˚C - 50˚C

Printing Speed:

30mm/s -60mm/s

Fan:

OFF

Direct Drive Retraction Distance:

3mm

Direct Drive Retraction Speed:

40mm/s

Indirect Drive Retraction Distance:

6mm

Indirect Drive Retraction Speed:

60mm

Annealing:

80˚C for 6 h

Recommended Support Materials:

PolySupport™ for PA12

Dry Settings:

100˚C for 8h

(Only if the material has absorbed moisture)

MEchanical Properties

(XY)Young's Modulus (MPa):

4735.7 ± 87.8 MPa

ISO 527, GB/T 1040

(Z)Young's Modulus (MPa):

2085.8 ± 91.7 MPa

ISO 527, GB/T 1040

(XY)Tensile Strength:

86.0 ± 0.9 MPa

ISO 527, GB/T 1040

(Z)Tensile Strength:

29.9 ± 2.1 MPa

ISO 527, GB/T 1040

(XY)Elongation at break(%):

2.8 ± 0.1 %

ISO 527, GB/T 1040

(Z)Elongation at break(%)

1.7 ± 0.1 %

ISO 527, GB/T 1040

(XY)Bending Modulus (MPa):

4331.2 ± 90.0 MPa

ISO 178, GB/T 9341

(XY)Bending Strength (MPa):

125.1 ± 2.6 MPa

ISO 178, GB/T 9341

(XY)Charpy Impact Strength:

6.8 ± 0.3 kJ/m2

ISO 179, GB/T 1043

Thermal Properties

Glass Transition Temperature:

N/A

DSC, 10°C/min

Melting Temperature:

N/A

DSC, 10°C/min

Heat Deflection Temperature
(1.8MPa):

114.3 °C

ISO 75 1.8MPa

Heat Deflection Temperature
(0.45MPa)

175.1 °C

ISO 75 0.45MPa

Material Properties

Technology

Warp-Free technology

Fiber adhesion technology

PolyMide™ PA612-CF

Color Range

Regular

FAQ

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Specifications

printsettings

Printing Temperature:

Bed Temperature:

Printing Speed:

Fan:

Direct Drive Retraction Distance:

Direct Drive Retraction Speed:

Indirect Drive Retraction Distance:

Indirect Drive Retraction Speed:

Annealing:

Recommended Support Materials:

Dry Settings:

MEchanical Properties

(XY)Young's Modulus (MPa):

(Z)Young's Modulus (MPa):

(XY)Tensile Strength:

(Z)Tensile Strength:

(XY)Elongation at break(%):

(Z)Elongation at break(%)

(XY)Bending Modulus (MPa):

(XY)Bending Strength (MPa):

(XY)Charpy Impact Strength:

Thermal Properties

Glass Transition Temperature:

Melting Temperature:

Heat Deflection Temperature(1.8MPa):

Heat Deflection Temperature(0.45MPa)

Material Properties

Technology

SKU List

Color Range

Diameter

Weight

Hello Polymaker

print
settings

Heat Deflection Temperature
(1.8MPa):

Heat Deflection Temperature
(0.45MPa)